PATT CIRCUITS is a professional high density interconnector (HDI) PCB manufacturer factory in China, high end PCB manufacturer in China
Production abiltity: 0.1mm laser buried vias or blind vias; 0.3mm BGA pad PCB, 0.35mm BGA PAD PCB, 0.4mm BGA PAD high density interconnector (HDI) PCB manufacturer, RESIN FILLED VIAS High Density Interconnector (HDI) PCB manufacturer, impedance controlled printed circuit board high density interconnector (HDI) PCB manufacturer High Density Interconnector (HDI) PCB are generally manufactured by the build-up method by High Density Interconnector (HDI) PCB maufacturer. The more build-up times, the higher the technical level of High Density Interconnector (HDI) PCB. Ordinary High Density Interconnector (HDI) PCB are basically laminated once, and high-end High Density Interconnector (HDI) PCB adopts 2 or more laminating techniques, while adopting advanced High Density Interconnector (HDI) PCB technologies such as stacking holes, electroplating hole filling, and laser direct drilling. High end PCB manufacturer in China, High-end High Density Interconnector (HDI) PCB manufacturers are mainly Intelligent mobile phones High Density Interconnector (HDI) PCB manufacturer, advanced digital cameras High Density Interconnector (HDI) PCB manufacturer, IC carrier High Density Interconnector (HDI) PCB manufacturer, etc.
