PCB Manufacturer China: How to solve thermal reliability problem of the PCB Printed Circuit Board

PCB Manufacturer in China share

In general, the distribution of copper foil on the PCB Printed Circuit Board is very complicated and difficult to accurately model. Therefore, the shape of the wiring needs to be simplified during modeling. The electronic components on the ANSYS model circuit board that are close to the actual circuit board can be simulated by simplified modeling, such as MOS tubes and integrated circuit blocks.

Thermal analysis

Thermal analysis assists the designer in determining the electrical performance of the components on the PCB Printed Circuit Board and helps the designer determine if the component or PCB Printed Circuit Board is burned out due to high temperatures. A simple thermal analysis simply calculates the average temperature of the PCB Printed Circuit Board, and a complex one creates a transient model of an electronic device with multiple PCB Printed Circuit Boards. The accuracy of the thermal analysis ultimately depends on the accuracy of the component's power consumption provided by the PCB Printed Circuit Board designer.

Weight and physical dimensions are important in many applications. If the actual power consumption of the component is small, the safety factor of the design may be too high, so that the design of the PCB Printed Circuit Board is based on the actual or inconsistent component power consumption value. Perform a thermal analysis. On the contrary (and at the same time more serious), the thermal safety factor is designed too low, that is, the actual operating temperature of the component is higher than that predicted by the analyst. Such problems are generally solved by adding a heat sink or a fan to the PCB PRINTED CIRCUIT BOARD. Cool down to solve. These external accessories add cost and extend PCB PRINTED CIRCUIT BOARD manufacturing time. Adding a fan to the design can also cause instability in PCB PRINTED CIRCUIT BOARD reliability. Therefore, the PCB PRINTED CIRCUIT BOARD mainly uses active rather than passive cooling (such as natural convection, conduction and radiation Cooling).

2. Simplified modeling of PCB PRINTED CIRCUIT BOARD

Before modeling, analyze the main heating devices in the PCB PRINTED CIRCUIT BOARD, such as MOS tubes and integrated circuit blocks, which convert most of the power loss into heat during operation. Therefore, these devices need to be considered primarily in modeling. In addition, copper foil coated as a wire on the printed wiring board(PCB PRINTED CIRCUIT BOARD) substrate is also considered. They not only play the role of electricity in the design, but also play the role of conducting heat. The thermal conductivity and heat transfer area are relatively large. The PCB CIRCUIT BOARD is an indispensable component of the electronic circuit. Its structure is composed of epoxy substrate. And consists of copper foil coated as a wire. The thickness of the epoxy resin substrate was 4 mm, and the thickness of the copper foil was 0.1 mm. The thermal conductivity of copper is 400 W/(m ° C), while the thermal conductivity of epoxy resin is only 0.276 W/(m ° C). Although the added copper foil is very thin and slim, it has a strong guiding effect on heat, so it cannot be ignored in modeling.

PATT CIRCUITS, high quality quickturn PCB manufacturer in Shenzhen, China. Quickturn fast PCB prototype, small batch quickturn PCB, Aluminum core PCB prototy, batch aluminum based PCB, copper substrate PCB, etc